Bluetooth Earphone PCB — 8L 2-Step, ENIG | Superb Automation
8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber
8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber
Bluetooth Module Carrier Board — RO4350B, 4L 1-Step HDI4-layer 1-step HDI · Rogers RO4350B · 0.55 mm · 14 × 21 mm · ENEPIG · Bluetooth 2.4 GHz ISM · Build-to-print from GerberProduct SpecificationsParameterValueProduct typeBluetooth module carrier bo