18-Layer TU883 2oz ENIG PCB for High-Current Power Distribution Backplane

18-Layer 2nd-Order HDI · 2oz Thick Copper · TU883 · 2.6mm · ENIG; High-Current Power Distribution Backplane

Product Specifications

High-Current Power Distribution Backplane
18-Layer 2nd-Order HDI · 2oz Thick Copper · TU883 · 2.6mm · ENIG

Carrier-Grade Power Distribution for Core Routing & HPC Clusters

Purpose-built as the power delivery backbone in telecom core switches, DWDM/OTN cross-connect matrices, and HPC server nodes. 18-layer second-order HDI with 2oz thick copper delivering hundreds of amps across the backplane while maintaining mechanical integrity at 2.6mm board thickness.

Board Specifications

Layers

HDI Technology

2nd-Order + Mechanical Blind Vias

Material

TU883 (TUC, Taiwan Union Technology)

Thickness

2.6mm

Surface Finish

ENIG (Electroless Nickel Immersion Gold)

Aspect Ratio

13:1

Copper Weight

2oz (70μm) — Heavy Copper

Trace/Space

0.1mm (4mil)

Via Fill

Resin-Filled Blind & Buried Vias

Board Size

216 × 243mm

Solder Mask

Green / White Silkscreen

Press Cycles

4-Layer / 5-Layer Sequential Lamination

System Role: Where This Board Fits

In a carrier-grade core switch, DWDM/OTN optical cross-connect, or HPC GPU cluster chassis, this board functions as the power delivery backbone — distributing -48V DC or 12V bus power across multiple line cards and compute modules. The 2oz thick copper planes handle 200–400A sustained current to feed Broadcom Tomahawk-class switch ASICs, large-scale FPGA clusters, or NVIDIA H100/B200-class GPU accelerator arrays. The 2.6mm board thickness provides the mechanical rigidity required for plug-in card architectures with high insertion-cycle endurance.

Key Technical Capabilities

Capability	This Board	Why It Matters
Deep-Hole Plating	2.6mm board × 13:1 AR → ~0.2mm through-hole plating	Uniform copper deposition across extreme depths; no barrel voids, no corner cracking
High-Current PDN	2oz copper on all power layers	200–400A sustained with ≤2% IR drop across 216mm board length
Mechanical Blind Vias	Hybrid HDI: laser microvias + controlled-depth mechanical blind vias	Vertical power routing between adjacent planes without consuming through-hole real estate
Resin-Filled Vias	Blind & buried vias filled with high-Tg epoxy resin, planarized flat	Via-in-pad capability for fine-pitch BGA power modules; eliminates solder wicking
Sequential Lamination	4-layer + 5-layer sub-stack press cycles	Scalable multi-press registration for 2nd-order HDI builds; minimal layer shift at 18 layers

TUC (台耀) TU883 Material — Stable Supply & Lamination Expertise

TU883 is a mid-loss, high-reliability laminate from Taiwan Union Technology (TUC). SUPERB maintains stable inventory of TU883 prepreg and core in standard thicknesses, eliminating supply-chain lead time risk for production runs. Our lamination team has extensive multi-press experience with TU883: controlled resin flow, consistent dielectric thickness (±8%), and proven adhesion across 4+ sequential press cycles — critical for the 18-layer hybrid HDI stackup with mechanical blind vias.

Deep-Hole Plating at 13:1 Aspect Ratio on 2.6mm Board

Plating a 0.2mm through-hole through 2.6mm of material at 13:1 aspect ratio is at the upper limit of conventional PCB manufacturing. SUPERB employs pulse-reverse electroplating with optimized bath agitation to achieve uniform 20–25μm copper in the barrel center — verified by cross-section micrograph on every production panel. This capability directly enables the 18-layer vertical interconnect density required by carrier-grade backplanes.

Target Applications

Equipment Class	Board Role	Representative Use
Core Switch / Router	Power distribution backplane	Cisco Nexus-class, Huawei CloudEngine-class chassis power delivery
DWDM/OTN Cross-Connect	Switch fabric power plane	Optical transport network shelf backplane; 200–400A distribution
HPC Server Node	GPU cluster power backplane	NVIDIA H100/B200-class accelerator底板; PCIe 5.0/6.0 power rails
Telecom BBU Shelf	Baseband unit power distribution	5G NR baseband processing shelf; multi-board power aggregation