6 layer UltraThin HDI Camera Board

6-layer ultra-thin HDI camera board by Superb Automation. 0.6mm finished thickness, 3/3mil trace/space, 4mil laser blind vias, ENIG finish, FR4 Tg≥150°C substrate. Optimized for MIPI D-PHY/C-PHY at 2.5Gbps/lane with <0.2dB/mm insertion loss at 3GHz.

Product Specifications

I. Core Technical Data Sheet

Production-validated 6-layer 1-step HDI platform with 0.6mm ultra-thin profile. Engineered for embedded camera modules demanding high-density interconnect, signal integrity, and thermal resilience.

Product Type	HDI 1-step laser blind via, expandable to any-layer interconnect
Target Application	EUS camera board — embedded camera module / image acquisition board
Layer Count	6 layers
Board Thickness	0.6 mm ±10%
Min Trace / Space	3 mil / 3 mil (0.075 mm / 0.075 mm)
Mechanical Drill	6 mil (0.15 mm)
Laser Drill	4 mil (0.10 mm) — blind via
Surface Finish	ENIG — Ni: 3~5 μm, Au: 0.05~0.1 μm
Substrate	Mid-to-high Tg FR4 (Tg≥150°C), laser-drill compatible resin
Copper	Outer ½ oz (18 μm), inner ⅓ oz (12 μm), finished ≥35 μm
Impedance Control	Diff: 100Ω ±10%; single: 50Ω ±10% (MIPI/LVDS)
Laser Via Aspect Ratio	0.8:1 (0.10 mm drill, dielectric ≤0.08 mm)
Mechanical Via AR	4:1 (0.6 mm board / 0.15 mm hole)
Solder Mask	Matte black photosensitive ink, supports 0.2 mm pitch components

Stackup & Structural Highlights

L1 — Signal + microstrip (MIPI differential) — laser blind via L1-L2
L2 — Solid reference ground plane
L3 — Inner signal (control / I²C / timing)
L4 — Inner signal (auxiliary data, low-speed peripherals)
L5 — Power distribution (split AVDD / DVDD)
L6 — Signal / shield ground + laser blind via L5-L6

Mechanical through vias connect L1-L6 for power and ground; laser blind vias enable high-density fan-out for 0.4 mm pitch image sensors.

Process Advantages	Laser blind via dimple ≤15μm, no residue at via bottom; fine-line compensation ensures >98% yield for 3/3 mil lines
Warpage Control	Symmetrical stackup, matched CTE; finished warpage ≤0.7% (IPC-6012 Class 3)
Signal Integrity	Intra-pair skew ≤2 mil; MIPI C-PHY/D-PHY insertion loss<0.2 db="">

Manufacturing Capability & Reliability

Capability	Mass Production Guarantee / Standard
Min Laser Via	4 mil (0.10 mm) stable; 3 mil available for samples
Min Mechanical Drill	6 mil (0.15 mm); AR 4:1 with margin
Blind Via Reliability	Thermal shock: -40°C to 125°C, 1000 cycles, ΔR ≤5%
HAST	130°C/85% RH, 96h, no ion migration, IR >1×10&sup9; Ω
Thermal Stress	288°C, 10 sec, 3 reflows, no delamination/barrel cracks
IST	500 cycles, ΔR<10%>
Microsection	Excellent bonding, no micro-cracks, undercut<2>

II. Application Case Stories

Three deployments spanning consumer, automotive, and medical imaging.

Case 1 — Flagship Smartphone Periscope Camera Module

A leading smartphone brand faced a challenge: increasing sensor size while reducing thickness. The original 8-layer through-hole design required 0.9 mm, but available stack-up space was only 0.65 mm. Superb proposed a 6-layer HDI solution at 0.6 mm, enabling full fan-out for a 120 MP CMOS sensor. 4 mil laser blind vias routed dense sensor pads to inner power layers, while 3/3 mil fine lines supported MIPI D-PHY four-lane at 2.5 Gbps/lane. After five SI optimization iterations, eye diagram margin improved 32% and spurious emissions dropped to -85 dBm. Assembly yield rose from 89% to 97.2%, with 18% cost reduction vs any-layer HDI. Deployed in two flagship models, 2M+ units shipped.

Case 2 — Automotive Surround-View Camera (ADAS)

A Tier-1 supplier needed a 120° wide-dynamic-range automotive camera operating from -40°C to 105°C with 15G vibration tolerance. The initial 4-layer FR4 board showed through-hole cracks during thermal cycling and EMI failures from MIPI traces crossing split ground planes. Superb customized a 6-layer HDI design: ISP and sensor co-located, laser blind vias (L1-L2) connecting decoupling capacitors, analog/digital ground planes strictly separated. ENIG finish ensures gold wire bonding reliability. Validated: 1500 thermal cycles (ΔR<3%), 3="" 25="" 500="" cispr="" class="" radiated="" emission.="" over="">

Case 3 — Medical Endoscope Miniature Imaging Module

A minimally invasive device manufacturer required a 4 mm diameter camera module PCB at 0.6 mm thickness, integrating an image sensor and illumination LEDs. The conventional 2-layer flex-rigid board suffered from poor signal quality. Superb provided an HDI rigid sub-board (6 layers, 0.6 mm) with 3/3 mil routing for dual-channel LVDS and laser micro-vias to reduce parasitic capacitance. The board survived 100,000 flex cycles; ENIG surface supported multiple low-temperature plasma sterilization cycles. Image noise reduced by 60%. Now in clinical validation, estimated 300,000 units/year demand.

Additional Deployments

Drone Obstacle Avoidance

Dual global-shutter cameras with integrated IMU. Laser blind vias shorten high-speed paths; 0.6 mm saves weight. BER<10⁻¹² under="" vibration="">

Industrial AI Vision Inspection

12 MP high-speed camera outputting GigE and MIPI simultaneously. HDI blind/buried vias improve SFR to 0.75 at Nyquist, defect detection rate up 30%.

Smart Door Access Camera

Wide-temperature dual-camera face recognition. 6-layer ENIG board ensures oxidation resistance; mixed vias reduced module height by 1.2 mm for IP54 protection.

III. Technical Advantages

High-Density Interconnect	Routes 128 I/Os of a CMOS sensor within 20×20 mm using laser blind vias, enabling high-pixel imaging.
Ultra-Thin Structure	0.6 mm 6-layer coreless process, supports -40°C to 125°C operation near heat sources.
Signal & Power Integrity	3/3 mil trace control, multi-layer ground plane shielding; MIPI insertion/return loss surpasses JEDEC standards.
Cost-Optimized	4 mil laser + 6 mil mechanical vias reduce lamination cycles; 1-step HDI lowers cost ~25% vs any-layer HDI.
Surface Finish	ENIG provides flatness for COB and small pads, 12-month storage life.

Certifications & Compliance

IPC-6012 Class 3 — High-reliability rigid board

UL 94 V-0 flammability rating

RoHS 2.0 & REACH compliant

IATF 16949 process control & VDA 6.3 audit

Customized impedance structure, CPK >1.33

IV. Solution & Delivery Capability

Superb provides one-stop service from schematic optimization, stackup recommendations, and impedance simulation to high-volume manufacturing. For camera products: MIPI compliance test reports, microsection analysis, and blind via reliability validation. Sample lead time as short as 48 hours; mass production 2–3 weeks. The 6-layer ultra-thin camera board is widely adopted in IP cameras, dashcams, medical endoscopes, and more — earning recognition from tier-one customers for high yield and stable electrical performance.

Design Rules

Min laser via: 4 mil
Mechanical drill: 6 mil
Trace/space: 3/3 mil
Max stacked vias: 2
Diff impedance: ±7Ω (100Ω target)

Capacity

Monthly: >5,000 m² (HDI line)
Laser: CO&sub2; + UV hybrid
Test: flying probe + AOI
SPC: CpK ≥1.33

Reference Designs

Sony IMX / OmniVision sensors
TI / Renesas ISP bridge chips
MIPI CSI-2 compliant

Superb Automation — Precision PCB Manufacturing & Assembly