The 1M803S Micro-Xinger® is a thin and compact 3dB hybrid coupler. It features an easy-to-use surface-mount package and is specifically designed for U-NII, ISM, and hyperLAN applications. The 1M803S is tailored for balancing amplifiers and signal distribution, making it an ideal solution for the growing demand in the wireless industry for smaller printed circuit boards and higher performance. The parts have undergone rigorous qualification tests, with 100% unit testing. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates (such as FR4 and G-10). They are produced using six RoHS-compliant tin plating processes. 

 

 

1M803S Characteristics: 

5.0 - 6.0 gigahertz 

Very low loss 

High isolation degree 

• 90° Orthogonal 

Surface Mounting 

•Tapes and reels 

• New Micro Package 

100% Test 

• Lead-free