Language:
PCBA
PCBA Manufacturing Process
At SUPERB AUTOMATION, our manufacturing process follows strict standards with full-process quality control (IQC/IPQC/QA) to ensure product reliability, matching the professional workflow in our production system.
Full Production Workflow
1Material Preparation
IQCComprehensive incoming quality check for all materials (PCBs, components, solder paste).
Key actions: X-Ray counting (99.99% accuracy) for components, DFM design review, and humidity control storage for sensitive parts.
2SMT - Solder Paste Printing
Precision printing of solder paste on PCB pads using automated stencil printers.
Control standards: 3D SPI (Solder Paste Inspection) to verify paste height, volume, and alignment (100% inspection rate).
3SMT - Component Mounting
Automated high-speed placement machines (HMT) for SMD components (resistors, capacitors, ICs).
Special handling: BGA/CSP components with vision alignment to ensure placement accuracy (±0.02mm).
4SMT - Reflow Soldering
12-zone reflow oven with nitrogen protection to prevent oxidation.
Pre-treatment: PCB baking (80°C/4h) for moisture-sensitive PCBs to avoid popcorning during soldering.
5SMT - Inspection (First Article & 100%)
IPQCFirst Article Inspection (FAI) to confirm process stability;
100% inspection via AOI (Automated Optical Inspection) + X-Ray (for BGA hidden solder joints) to detect defects.
6DIP - Component Insertion
Combination of automated insertion (for standard through-hole components) and manual insertion (for special connectors).
Pre-inspection: Visual check of component orientation and insertion depth.
7DIP - Wave Soldering
Lead-free wave soldering with nitrogen protection to ensure solder joint quality.
Post-soldering: Online AOI to check solder bridges, cold joints, and missing solder.
8Pre-Test
Initial functional test to verify basic electrical performance (voltage, current, signal continuity).
Test stations: Dedicated fixtures for different product models to ensure test efficiency.
9Burn-In Test
Accelerated life test under high-temperature (40-60°C) and full-load conditions for 24-168 hours.
Purpose: Screen out early-failure components and ensure long-term reliability.
10Final Test (F-TEST)
Comprehensive functional test covering all product specifications (performance, communication, interface).
Inspection rate: 100% QA inspection to ensure no defective products enter packaging.
11Cleaning & Touch-Up
Ultrasonic cleaning to remove flux residues and contaminants;
Manual touch-up for minor defects (solder bridges, cold joints) by certified technicians.
12Packaging (QA)
QAFinal quality audit before packaging;
Customized ESD packaging with humidity control, and full traceability labels (batch number, production date, test results).
Process Comparison (SUPERB vs Industry Average)
| Stage | SUPERB Process (Matching PPT Workflow) | Industry Average | Core Advantage |
|---|---|---|---|
| Material Prep & IQC |
|
|
Eliminates 95% of material-related issues |
| SMT (Print-Mount-Reflow) |
|
|
SMT defect rate < 0.1% (industry: 0.5-1%) |
| Testing (Pre/Burn-In/Final) |
|
|
Field failure rate reduced by 80% |
| Packaging & Shipping |
|
|
Transit damage rate < 0.05% |
Full-Process Quality Control
IQC (Incoming Quality Control)
Strict inspection of all incoming materials to prevent defective parts from entering production, including X-Ray component counting and DFM review.
IPQC (In-Process Quality Control)
Real-time monitoring at key processes (printing, reflow, wave soldering) with first article inspection and C-CHART statistical process control.
QA (Final Quality Assurance)
100% final inspection before packaging and shipping, ensuring all products meet specifications and providing full traceability records.
PCBA
Contact Us
Superb Automation Co., Limited
Website:www.superb-tech.com
For 25 years your reliable partner in Electronics & PCBA!
HK number: 852 4459 0634
Email :Info@superb-tech.com
Whatsapp:8613396081443