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PCB Introduction
Precision Manufacturing and Superior Quality
From engineering design (DFM) to final delivery, our production and testing processes are fully digitalized for end-to-end monitoring. With advanced process technology and comprehensive testing methods, we provide solid quality assurance for your products from prototyping to mass production.
For more information, please contact us at: pcb@superb-tech.com
PCB Process & Testing Workflow
We’ve organized the production process into 6 core stages based on manufacturing logic, making it easier to understand the full lifecycle of PCB production and quality control.
Stage 1: Pre-Production Preparation
Lay the foundation for manufacturing by verifying design feasibility and defining process parameters.
| Process Name | Main Purpose | Instruments & Processes |
|---|---|---|
| Pre-production Engineering | Review design documents and determine process parameters | 1. Manual review of design documents to confirm compliance with manufacturing capabilities 2. CAM (Computer-Aided Manufacturing) software to check the integrity and accuracy of design data (e.g., line width, hole position, layer alignment) |
Stage 2: Inner Layer Circuit Fabrication
Create precise inner-layer circuits, the core conductive layer of multi-layer PCBs.
| Process Name | Main Purpose | Instruments & Processes |
|---|---|---|
| Inner Layer Imaging | Accurately transfer circuit patterns onto inner-layer copper-clad boards | AOI (Automated Optical Inspection) equipment: Compare with standard patterns to verify: - Integrity of circuit patterns - Accuracy of line width and line spacing - Absence of missing lines or short circuits |
| Etching | Remove unnecessary copper foil to form precise inner-layer circuits | 1. AOI equipment: Detect over-etching/under-etching and neatness of circuit edges 2. Metallographic microscope: Observe cross-sections to confirm copper layer thickness meets requirements |
| Photoresist Stripping | Completely remove residual photoresist from inner-layer circuits | 1. Visual inspection (or with a magnifying glass) 2. Confirm no photoresist residue remains on circuit surfaces (residue may affect subsequent lamination) |
| Inspection & Post-Etch Punch | Inspect inner-layer circuit quality and complete positioning holes | 1. AOI equipment: Recheck for circuit defects (e.g., open circuits, short circuits) 2. Hole diameter measuring instrument: Verify hole size accuracy 3. Coordinate measuring instrument: Check hole position precision (ensures alignment with other layers) |
| Alternative Oxide Coating | Form a uniform anti-oxidation coating on copper layer surfaces | 1. Film thickness gauge: Measure coating thickness (ensures uniformity) 2. Surface roughness tester: Detect coating surface roughness (optimizes adhesion for lamination) |
Stage 3: Lamination & Drilling
Bond multi-layer materials and drill holes for inter-layer connection.
| Process Name | Main Purpose | Instruments & Processes |
|---|---|---|
| Lamination | Press multi-layer board materials together under high temperature and pressure | 1. X-ray inspection equipment: Detect internal air bubbles and inter-layer alignment (prevents delamination) 2. Hardness tester: Measure board hardness (ensures structural stability) |
| Drilling | Drill vias (for inter-layer conduction) and mounting holes per design requirements | 1. Hole diameter measuring instrument: Verify hole size accuracy 2. Hole position measuring instrument: Check hole position precision 3. Microscope: Observe hole wall quality (e.g., no burrs, no delamination) |
Stage 4: Outer Layer Circuit Fabrication
Complete outer-layer circuits and ensure electrical conduction between layers.
| Process Name | Main Purpose | Instruments & Processes |
|---|---|---|
| Metallization of the Dielectric | Deposit a metal layer on hole walls and insulating surfaces to achieve electrical conduction | 1. Metallographic microscope: Observe thickness and uniformity of the hole-wall metal layer 2. Micro-ohmmeter: Measure resistance of the hole metal layer (ensures low-resistance conduction) |
| Outer Layer Imaging | Accurately transfer outer-layer circuit patterns onto the board surface | AOI equipment: Check: - Accuracy of pattern transfer - Integrity of outer-layer circuits - Alignment with inner layers |
| Copper Plating | Uniformly plate a copper layer on the board surface and in holes | 1. Film thickness gauge: Measure copper plating thickness (ensures conductivity and durability) 2. Hull cell test: Evaluate plating solution performance (indirectly reflects copper plating quality) |
| Photoresist Stripping (Outer Layer) | Remove photoresist used in outer-layer circuit fabrication | Visual inspection (or with a magnifying glass): Confirm no photoresist residue on outer-layer circuits |
| Final Etching | Precisely etch to form the final outer-layer circuit | 1. AOI equipment: Check for short circuits, open circuits, and etching quality 2. Metallographic microscope: Observe circuit cross-section size (ensures compliance with design specifications) |
| Tin Stripping | Remove the protective tin layer on circuits | Visual inspection: Confirm complete removal of the tin layer (residue may affect solder mask application) |
Stage 5: Surface Treatment & Marking
Protect circuits, improve solderability, and add identification marks.
| Process Name | Main Purpose | Instruments & Processes |
|---|---|---|
| Solder Mask Application | Accurately apply a solder mask layer and expose pads | 1. AOI equipment: Check: - Coverage of the solder mask layer (no missing areas) - Accurate exposure of pads (prevents solder mask from covering pads) 2. Film thickness gauge: Measure solder mask thickness (ensures insulation and durability) |
| Surface Finish | Improve circuit surface solderability and anti-oxidation performance | 1. Film thickness gauge: Measure the thickness of the surface treatment layer (e.g., ENIG, HASL) 2. Contact angle measuring instrument: Detect surface wettability (ensures good solderability) |
| Silkscreen | Print clear characters, logos, or part numbers | 1. Visual inspection: Check clarity and integrity of characters/logos 2. Magnifying glass: Verify neatness of silkscreen pattern edges (no smudging or blurring) |
Stage 6: Electrical Test & Shaping
Verify electrical performance and cut boards into finished products.
| Process Name | Main Purpose | Instruments & Processes |
|---|---|---|
| Electrical Test | Detect PCB electrical performance | 1. Flying probe tester (for small-batch/prototype): Detect open circuits, short circuits, insulation resistance, and impedance 2. Bed-of-nails tester (for mass production): High-speed testing of electrical parameters (ensures no functional defects) |
| Routing & V-Scoring | Cut boards into individual finished products or machine V-grooves (for easy separation) | 1. Calipers: Measure the size of cut boards (ensures compliance with design dimensions) 2. Microscope: Check cut edge quality (no burrs or damage to circuits) |
Why Choose Our PCB Manufacturing?
- Full Digital Monitoring: Every process is tracked digitally, ensuring traceability of quality data.
- Multi-Level Quality Checks: AOI, microscopic inspection, and electrical testing are integrated into each stage to avoid defects.
- Professional Equipment: Advanced instruments (e.g., X-ray inspection, flying probe testers) guarantee precision.
For customized PCB solutions or technical consultations, contact us at pcb@superb-tech.com!
PCB
Contact Us
Superb Automation Co., Limited
Website:www.superb-tech.com
For 25 years your reliable partner in Electronics & PCBA!
HK number: 852 4459 0634
Email :Info@superb-tech.com
Whatsapp:8613396081443