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RF/Microwave PCB Manufacturing Capabilities
📡 High-Frequency (RF/Microwave) PCB Manufacturing Capabilities
Scope & Use Cases: Production-grade RF and microwave PCBs for 500 MHz up to mmWave, covering microstrip, stripline, and hybrid dielectric stackups. Built for automotive 77 GHz radar, SATCOM (Ku/Ka), phased arrays, RF front-ends/PA, aerospace & defense. Conforms to IPC-6018 performance requirements for high-frequency printed boards; RF laminates per IPC-4103.
🔧 Mass-Production Parameters
| Item | Mass-Production Capability | RF Notes |
|---|---|---|
| Min. Line/Space | 0.05/0.05 mm | Down to 0.035/0.035 mm in HDI fan‑out zones when required. |
| Min. Drill (Mech./Laser) | 0.15 mm / 0.075 mm | Laser microvias with resin plug or copper‑filled VIP for BGA RF escape. |
| Back-drill (Stub Control) | Residual stub ≤ 0.25 mm (≈10 mil) typical | Target ≤ 10 mil to reduce reflections on high‑speed/RF links. |
| Layer Count / Thickness | Up to 68 L, 0.2–12 mm | Supports sequential lamination and HDI/ELIC for dense RF + digital mixes. |
| Layer Registration | ±0.025–0.06 mm | Maintains coupling gaps and impedance stability in multi‑lamination builds. |
| Impedance Control | ±5% (MP); special build to ±2% | Tight tolerance via laminate Dk/Df control, copper roughness, etch comp., and solder mask windowing. |
| RF Materials | Rogers RO4350B/RO4003C/RO4835; Taconic TLY‑5/CER series; PTFE/ceramic; Hybrid (FR‑4 + RF) | RO4350B Dk≈3.48±0.05, Df≈0.0037@10 GHz; TLY‑5 Dk≈2.17–2.40, Df≈~0.0009@10 GHz. |
| Surface Finish | ENIG, ENEPIG, ImmAg, OSP, selective hard gold | ENIG/ENEPIG common on RF pads; ImmAg favored on antenna zones to minimize contact loss. |
| Vias & Fill | Blind/buried via, resin plug, copper fill, VIP | Reduces via inductance and improves reflow reliability in RF BGAs. |
| Routing & Controlled Depth | Back‑drill + depth routing | Preserves field distribution near antenna feeds and coupling gaps. |
| Test & Metrology | Flying‑probe/fixture test, TDR, differential impedance, microsection | RF consistency verified in time domain + cross‑section QC. |
⚙️ RF Process Highlights
Materials & Stackups. Rogers RO4350B/RO4003C/RO4835 and Taconic TLY‑5/CER‑10 low‑loss systems; available as homogeneous or mixed‑dielectric multilayers per IPC‑6018 types (incl. metal‑back options).
Impedance & Layout. Production tolerance ±5%; ±2% available as a special build. Favor arcs/45° miters over 90° corners; manage copper roughness and mask clearance for predictable Zo. (Standards orientation via IPC‑4103 for HF materials.)
Stub Suppression. Back‑drilling with defined stop layers; design for ≤ 10 mil residual stub; slightly larger back‑drill bit ensures full stub removal.
Impedance & Layout. Production tolerance ±5%; ±2% available as a special build. Favor arcs/45° miters over 90° corners; manage copper roughness and mask clearance for predictable Zo. (Standards orientation via IPC‑4103 for HF materials.)
Stub Suppression. Back‑drilling with defined stop layers; design for ≤ 10 mil residual stub; slightly larger back‑drill bit ensures full stub removal.
📦 Representative RF Materials
| Material | Key Properties |
|---|---|
| Rogers RO4350B | Dk 3.48 ± 0.05, Df 0.0037@10 GHz; FR‑4‑like processing; stable CTE. |
| RO4003C / RO4835 | Low tolerance Dk/Df families for broadband/millimeter‑wave designs. |
| Taconic TLY‑5 / CER‑10 | Very low Df; 77 GHz‑proven insertion loss; Dk tunable by resin content. |
âś… Quality & Standards
Built and inspected to IPC‑6018 for HF/microwave PCBs; laminate selection per IPC‑4103 slash sheets. Verification includes TDR, controlled‑impedance test coupons, and microsections.
📡 Applications
Mainly targeted for frequencies from 500 MHz up to mmWave, including:
Automotive 77GHz RadarSatellite Communications (SATCOM)Phased Array AntennasRF Front‑ends / Power AmplifiersAerospace & Defense
PCB
Contact Us
Superb Automation Co., Limited
Website:www.superb-tech.com
For 25 years your reliable partner in Electronics & PCBA!
HK number: 85260404363
Email :Info@superb-tech.com
Whatsapp:8613396081443