X3C19F1-03S is a low-profile, high-performance 3dB hybrid coupler in a new, user-friendly, and manufacturing-friendly surface-mount package. It is designed for applications in AMPS, GSM, WCDMA, and LTE frequency bands. X3C19F1-03S is specifically designed for balancing power and low-noise amplifiers, along with signal distribution and other applications that require low insertion loss and strict amplitude and phase balance. It can be used in high-power applications up to 25 watts.
The parts have undergone rigorous testing and have been manufactured using materials with a coefficient of thermal expansion (CTE). These materials are compatible with common substrates such as FR4, G-10, RF-35, RO4003 and polyimide. Six soldered finish parts in compliance with RoHS standards are produced.