X3C70F1-20S is a low-profile, high-performance 20dB directional coupler in a new, user-friendly, and manufacturing-friendly surface-mount package. It is designed for microwave applications. X3C70F1-20S is specifically tailored for high-frequency wireless links and other applications that require low insertion loss and strict amplitude and phase balance. It can be used in high-power applications up to 15 watts.
The parts have undergone rigorous testing and have been manufactured using materials with a coefficient of thermal expansion (CTE). These materials are compatible with common substrates such as FR4, G-10, RF-35, RO4003 and polyimide. Six soldered finishings in accordance with RoHS standards have been produced.