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Superb PCB Acceptance & Outgoing Quality Standards

Superb PCB Acceptance & Outgoing Quality Standards
Final Inspection Items · Acceptance Criteria · Report Interpretation
Before shipment, every PCB batch must pass a predefined set of tests and visual checks. The table below lists each report item, its inspection purpose, what is actually measured, and what a passing result guarantees for your assembly.

Outgoing Inspection Report Items

Report Item Inspection Purpose What is checked Passing means
Board Thickness Verify thickness meets design Total board thickness within tolerance Board fits enclosure, no assembly interference
Dimensions Verify length, width, slots, holes Length, width, hole positions, slot size, edge distance Board mounts correctly, no alignment issues
Microsection Inspect internal structure quality Layer shift, hole copper thickness, wall integrity, delamination Internal connections are reliable, not just surface good
Plated Copper in Hole Verify conductive layer on hole wall Copper continuity, thickness, cracks Current flows reliably between layers
E-Test Result Verify continuity and isolation Open, short, wrong connection Basic electrical function is correct
Visual Inspection Ensure appearance meets delivery standard Scratches, exposed copper, contamination, mask/legend defects Cosmetically acceptable, no workmanship issues
Solderability Test Confirm pads can be soldered easily Wetting coverage, angle, non‑wetting, dewetting SMT or hand soldering will not have wetting problems
Surface Finish Check Verify pad surface condition Uniformity, discoloration, roughness of ENIG/HASL/OSP Pads are oxidation‑free, solderability guaranteed
Warp & Twist Verify board flatness Bow and twist measurement No component lifting, no soldering defects, fits assembly

What Each Inspection Method or Abbreviation Means

Item / Abbr. Full Name What it does / Finds
Microsection Cross‑section analysis Cuts and polishes a sample to reveal layer alignment, hole copper thickness, cracks, delamination – detects internal defects invisible to X‑ray
E‑Test Electrical Test Tests all nets for open circuits, shorts, and wrong connections using flying probe or fixture
AOI Automated Optical Inspection Compares circuit pattern against design data to find broken traces, shorts, notches, residual copper
X‑Ray X‑Ray Inspection Looks at hidden structures (e.g., layer shift, BGA voiding, inner layer registration) non‑destructively
Solderability Test Solderability (Dip & Wetting) Test Checks pad wetting quality to ensure reliable assembly soldering
FQC / OQC Final / Outgoing Quality Control Visual and dimensional check before packing; final gate before shipment
SUPERB Automation Acceptance Guarantee
Every board that passes the above tests is backed by full traceability. We maintain a zero‑defect policy for critical parameters (open/short, hole copper thickness, solderability). A complete inspection report including microsection photos, e‑test logs, and dimensional data is available upon request.
Reference: IPC-6012 Class 2/3 · Test methods per IPC-TM-650 · All inspections performed on statistically sampled lots or 100% where required.

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