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Superb PCB Manufacturing Process & Control Standards

Superb PCB Manufacturing Process & Control Standards

From Gerber to Shipment · Every Step Defined and Controlled

This document outlines the complete PCB production workflow, the purpose of each step, key inspection points, methods, and acceptance criteria. All processes comply with IPC standards and customer-specific requirements.
Process Stage Abbr. What is done Why needed Key inspections Method / Equipment Acceptance benchmark
Customer provides data Gerber Customer supplies Gerber, drill, outline, solder mask, legend data Factory must know exactly what to build File completeness, layer count, hole size, outline clarity CAM engineering review, file import check Matches customer Gerber, drill files, specification sheet
Engineering questions EQ Factory asks for clarification on unclear, risky, or contradictory data Prevent misinterpretation and avoid wrong boards Board thickness, copper thickness, impedance, drill feasibility, surface finish Engineering review, DFM analysis, CAM compare Based on customer confirmed answers and final execution requirements
CAM engineering CAM Convert design data into production‑ready files (compensation, panelization, drill tapes, films) Design data must be adapted for manufacturing Compensation logic, panel layout, drill data match, layer consistency CAM software, engineering verification Matches Gerber + EQ confirmation + factory process rules
Inner layer cutting Cutting Cut base material to production panel size Prepare material for inner layer processing Material type, dimensions, copper weight, surface condition Incoming material check, dimension check Matches customer required material, thickness, copper weight
Inner layer imaging Inner Layer Form circuit pattern on inner copper foil, etch away unwanted copper Multi‑layer boards need inner circuits before lamination Trace width, spacing, open, short, residual copper, notches AOI, visual inspection, measurement Matches Gerber pattern, process tolerance, IPC standards
Inner layer inspection AOI Automated optical inspection of inner layer patterns Catch defects like open, short before lamination Open, short, notches, burrs, pattern distortion AOI equipment Matches design pattern data
Lamination Lamination Press inner layers, prepreg and copper foil into a single multilayer board Form the complete multilayer structure Thickness, layer bonding, delamination, voids, warpage Thickness measurement, microsection, visual Matches stackup, total thickness, tolerance requirements
Drilling Drilling Drill through holes, mounting holes, tooling holes per data Holes are essential for component mounting and interlayer connection Hole size, position, offset, burrs, damage to inner pads Drilling machine, hole position check, first article Matches drill file, hole size tolerance, position tolerance
Plated Through Hole PTH Deposit copper on hole walls to make them conductive Without continuous copper, current cannot flow between layers Copper thickness in hole, continuity, voids, cracks, adhesion Microsection, microscope, thickness gauge Matches customer requirements, IPC-6012 standards
Outer layer imaging Outer Layer Form final outer circuit pattern on PCB surface Outer circuits define final functional connectivity Trace width, spacing, short, open, pad integrity AOI, visual, measurement Matches outer layer Gerber data and process tolerance
Solder mask SM Apply solder mask (green/black etc.) over non‑solder areas, expose pads Prevent shorts, oxidation, contamination, improve insulation Mask misregistration, exposed copper, mask on pads, bubbles, debris, adhesion Visual, alignment check, adhesion test Matches solder mask opening drawing, color requirement, IPC standard
Silkscreen / Legend Silkscreen Print component identifiers, logo, orientation marks, part number Facilitate assembly, identification, repair Wrong print, clarity, ink on pads Visual inspection Matches legend layer file
Surface finish ENIG / HASL / OSP etc. Apply final finish on pads (immersion gold, HASL, OSP, immersion tin) Prevent oxidation, ensure solderability Uniformity, discoloration, roughness, pad integrity Visual, thickness measurement, solderability test Matches customer specified surface finish and process standards
Routing / V-CUT Routing Mill panel into final customer board shape Ensure board fits into customer assembly Length, width, slots, edge burrs, contour consistency Routing machine, V‑cut machine, caliper, 2.5D measurement Matches outline drawing, dimension drawing, tolerance
Electrical test E‑Test Test that nets are connected as designed and isolated where required Verify basic electrical function of the PCB Open, short, wrong connection Flying probe, fixture test Matches netlist, Gerber data
Final visual inspection FQC / OQC Thorough visual check before shipment Prevent obvious defects reaching customer Scratches, exposed copper, contamination, warpage, legend defects, mask anomalies Visual, magnifier, flatness check Matches IPC‑A‑600, customer appearance requirements
Microsection analysis Microsection Cut and polish a small sample to observe internal structure Detect issues invisible from outside Layer misregistration, hole copper thickness, cracks, inner ring integrity, delamination Cut, polish, microscope Matches IPC, customer, process specifications
Solderability test Solderability Verify that pads can be easily wetted by solder Ensure customer assembly does not suffer from poor wetting or non‑wetting Solder coverage, wetting angle, non‑wetting, dewetting Dip test, microscope, solderability tester Matches solderability standards, customer assembly requirements
Shipment report COC / QA report Compile key test results into document for customer Prove that the batch has been inspected and conforms Thickness, dimensions, microsection, hole copper, visual, e‑test, solderability Inspection record summary, report generation Matches customer order requirements, inspection standards, final pass judgement
All processes are subject to internal audits and continuous improvement. For special requirements, additional inspections or sampling plans can be applied.

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