Our Commitment to Quality
Every component batch undergoes rigorous incoming inspection before entering production. We maintain zero tolerance for counterfeits and enforce AQL 0.65 for major defects. If a batch fails even one critical criterion, the entire lot is rejected and returned.
X‑Ray inspection: Verifies die presence, bond wire layout, and voiding. We maintain a golden sample library for instant comparison.
C‑SAM (Scanning Acoustic Microscopy): Detects internal delamination and cracks invisible to X‑ray – crucial for moisture‑sensitive or reworked components.
JTAG ID verification: Reads hardware‑fused device IDCODE – impossible to counterfeit.
Destructive decapsulation: Used on suspicious batches to expose the bare die and verify manufacturer logo, die revision, and consistency.
Inspection Equipment & Pass Criteria
Equipment
Inspection / Measurement
Pass Criteria
LCR Meter
R, C, L, ESR, Q
Within ±1% / ±5% tolerance
Digital Multimeter
Diode Vf, shorts/opens, pin impedance
Matches golden sample or datasheet
Microscope (50–200×)
Marking quality, surface, leads/balls
No sanding, no residue, crisp marking
X-Ray
Die, bond wires, voiding
Matches golden reference; void ≤25% per ball
C-SAM
Delamination, cracks
No significant red/yellow areas
Solderability Tester
Wetting area, angle
≥95% coverage, angle < 90°
Nonconforming Material Disposition
Immediate segregation and red NC tag, moved to locked quarantine area.
Quality Engineer re‑inspection before final decision.
Disposition options: Return to vendor (RTV), exchange, or sort & use only with signed Engineering approval.
Supplier Corrective Action Report (SCAR) or 8D within 48 hours. Corrective action verified on next three incoming lots.
✅ Trusted by global customers
Our incoming inspection has intercepted thousands of counterfeit and substandard components, ensuring zero defective parts reach your production line. We stand behind every batch with full traceability and rapid corrective action.