The new technology of 5G base station antenna filters + heat dissipation devices

Recently, Korea Mobile Warehousing (KMW) announced a new technology combining 5G base station antenna filters and heat dissipation devices.

Today, we won't delve into complex formulas. Instead, let's break it down layer by layer using 17 core diagrams—just to understand how this antenna actually dissipates heat?

First, look at the entire unit: the heatsink directly "extends" from the antenna housing

Figure 1a / Figure 1b Front + Rear View of the Complete Machine

The radome covers the radiating unit, with a single continuous heat dissipation plate extending directly from the top to facilitate direct heat exchange with the external air

The traditional large-area heat dissipation fins are retained to handle the rear-end heat dissipation of the digital board.

Traditional antennas rely solely on the back for heat dissipation, trapping heat inside; KMW directly integrates the cooling channel at the top, exposing it externally to achieve internal heat and external exhaust, achieving complete separation.

Figure 2a / 2b Explosion View

The whole machine is disassembled into three parts: housing, RF module, and protective heat dissipation component.

There is a guide slot at the top: the RF module is directly inserted vertically for installation.

Antenna cover with extension plate and ventilation hole: both windproof and rainproof, without blocking heat dissipation.

Finger protection board: prevents people from touching high-temperature heat dissipation surfaces.

Disassembling the interior: Heat is "sucked away" as soon as it is generated

Figure 3: Removing the Inner Cover

At a glance, it can be seen that multiple columns of RF modules are vertically arranged side by side, with a vertical heat dissipation plate inserted in the middle of each column.

The lower part absorbs heat inside the shell

The upper half extends outside the shell to dissipate heat

Figure 4 Assembly of a single RF module

The module is directly inserted into the housing from the top, and the tail is connected to the digital board as soon as it is inserted. The electrical connection and heat dissipation are completed in one step.

Figure 5 Module Tail Structure

The middle is the heat dissipation plate, and the two sides are dual polarized antenna units. The PA board (a major heat source) is tightly attached to the heat dissipation plate.

Conclusion: As soon as heat is generated, it is immediately absorbed without leaving any accumulation.

Core structure: Sandwich heat dissipation, one plate tube with two polarizations

Figure 6 Left and Right Perspectives

The structure is very clear: left polarization unit - heat dissipation plate - typical sandwich layout of right polarization unit, one heat dissipation plate simultaneously provides heat dissipation for two polarizations, maximizing space utilization.

Figure 7a/7b Module Disassembly

Take it apart to see more clearly:

Middle: Phase change heat dissipation module

On both sides: PA board (PA/LA/RFIC are all here, hottest)

Outer side: RF filters stacked on top and bottom

Front: Radiation unit

Heat path: heat source → PA board → heat dissipation board → external air, too short to be any shorter.

Single channel unit: The heat dissipation plate is not solid aluminum, but a "uniform heat plate"

Figure 8 Single polarization antenna unit

There are many small circular reinforcement ribs on the heat dissipation board, not for decoration.

Function: Resist internal pressure and prevent deformation caused by thermal bulging.

Further disassembly of Figures 9a/9b

The heating chip on the PA board is in full contact with the heat dissipation board.

Surface contact ≈ the most efficient heat dissipation, much stronger than point contact and line contact.

Profile understanding: internal heat and external exhaust, clear at a glance

Figure 10/11/12 sectional view

  These pictures directly capture the logic:

Inner heat dissipation part

Inside the antenna casing, absorb heat from the PA board

External heat dissipation part

Thread out of the top of the shell and directly blow air to dissipate heat

Radiation in front, filtering in the middle, digital board in the back, and heat dissipation throughout the entire process.

Core: Figure 13 Internal principle of heat dissipation board (understanding this picture is enough)

The heat dissipation plate is a hollow sealed structure, and it is not made of solid metal inside.

Charge refrigerant and follow phase change cycle:

Simply put, this is a 'heating plate inserted into the antenna'.

Advanced solution: One heat dissipation board, double-sided heat absorption

Figure 14/15/16 Double sided heat dissipation structure

Directly move the same heat dissipation structure to LED lamps:

LED heating → inner heat absorption → outer exposed heat dissipation

Prove that this solution is universal, replicable, and not limited to base station antennas.

Complete design, one sentence summary

Essentially, it is one thing: using a "phase change heating plate" to directly "transfer" the heat from the PA and filter inside the antenna to the outside of the casing for dissipation.

The internal integration is highly integrated, and the external heat dissipation is extreme, perfectly adapting to 5G Massive MIMO high-density and high heating scenarios.