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HDI PCB Manufacturing Capability

HDI PCB Manufacturing Capability

 

🔌 HDI PCB Manufacturing Capabilities | 30-Layer ELIC HDI Board Fabrication

Superb delivers advanced HDI (High-Density Interconnect) PCB manufacturing solutions, supporting up to 30-layer ELIC (Every Layer Interconnect) structures with ultra-fine features. Production ensures superior electrical performance and high-density routing for AI modules, automotive electronics, and communication devices.

📊 HDI Parameter Table (2026)

Parameter Value
Max. Layer counts ≤30 L ELIC
Max. Production size (mm) 540 × 620
Board thickness (mm) 0.2 – 4.0
Min. core thickness (mm) 0.05
Min. laser hole diameter / pad (mm) 0.05 / 0.15
Min. mech. hole diameter / pad (mm) 0.15 / 0.30
Min. line width / spacing (mm) 0.035 / 0.035
BGA Pitch (mm) 0.3
Copper thickness (oz) 1
Misalignment of layers (mm) ±0.06
Blind hole depth ratio 1:1
Through hole thickness / diameter ratio 6:1
Hole filling depression (μm) ≤8
Warpage ≤0.5%
Solder resist ±5%
PTH Tolerance (mm) ±0.075
NPTH Tolerance (mm) ±0.05
Press Fit Hole tolerance (mm) ±0.05
Slot Hole tolerance (mm) ±0.1
Outline tolerance (mm) ±0.1

📡 Applications

AI ModulesAutomotive ElectronicsCommunication Devices

Contact Us

Superb Automation Co., Limited

Website:www.superb-tech.com

For 25 years your reliable partner in Electronics & PCBA!

HK number: 85260404363

Email :Info@superb-tech.com

Whatsapp:8613396081443