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RF/Microwave PCB Manufacturing Capabilities

RF/Microwave PCB Manufacturing Capabilities

 

📡 High-Frequency (RF/Microwave) PCB Manufacturing Capabilities

Scope & Use Cases: Production-grade RF and microwave PCBs for 500 MHz up to mmWave, covering microstrip, stripline, and hybrid dielectric stackups. Built for automotive 77 GHz radar, SATCOM (Ku/Ka), phased arrays, RF front-ends/PA, aerospace & defense. Conforms to IPC-6018 performance requirements for high-frequency printed boards; RF laminates per IPC-4103.

🔧 Mass-Production Parameters

Item Mass-Production Capability RF Notes
Min. Line/Space 0.05/0.05 mm Down to 0.035/0.035 mm in HDI fan‑out zones when required.
Min. Drill (Mech./Laser) 0.15 mm / 0.075 mm Laser microvias with resin plug or copper‑filled VIP for BGA RF escape.
Back-drill (Stub Control) Residual stub ≤ 0.25 mm (≈10 mil) typical Target ≤ 10 mil to reduce reflections on high‑speed/RF links.
Layer Count / Thickness Up to 68 L, 0.2–12 mm Supports sequential lamination and HDI/ELIC for dense RF + digital mixes.
Layer Registration ±0.025–0.06 mm Maintains coupling gaps and impedance stability in multi‑lamination builds.
Impedance Control ±5% (MP); special build to ±2% Tight tolerance via laminate Dk/Df control, copper roughness, etch comp., and solder mask windowing.
RF Materials Rogers RO4350B/RO4003C/RO4835; Taconic TLY‑5/CER series; PTFE/ceramic; Hybrid (FR‑4 + RF) RO4350B Dk≈3.48±0.05, Df≈0.0037@10 GHz; TLY‑5 Dk≈2.17–2.40, Df≈~0.0009@10 GHz.
Surface Finish ENIG, ENEPIG, ImmAg, OSP, selective hard gold ENIG/ENEPIG common on RF pads; ImmAg favored on antenna zones to minimize contact loss.
Vias & Fill Blind/buried via, resin plug, copper fill, VIP Reduces via inductance and improves reflow reliability in RF BGAs.
Routing & Controlled Depth Back‑drill + depth routing Preserves field distribution near antenna feeds and coupling gaps.
Test & Metrology Flying‑probe/fixture test, TDR, differential impedance, microsection RF consistency verified in time domain + cross‑section QC.

⚙️ RF Process Highlights

Materials & Stackups. Rogers RO4350B/RO4003C/RO4835 and Taconic TLY‑5/CER‑10 low‑loss systems; available as homogeneous or mixed‑dielectric multilayers per IPC‑6018 types (incl. metal‑back options).
Impedance & Layout. Production tolerance ±5%; ±2% available as a special build. Favor arcs/45° miters over 90° corners; manage copper roughness and mask clearance for predictable Zo. (Standards orientation via IPC‑4103 for HF materials.)
Stub Suppression. Back‑drilling with defined stop layers; design for ≤ 10 mil residual stub; slightly larger back‑drill bit ensures full stub removal.

📦 Representative RF Materials

Material Key Properties
Rogers RO4350B Dk 3.48 ± 0.05, Df 0.0037@10 GHz; FR‑4‑like processing; stable CTE.
RO4003C / RO4835 Low tolerance Dk/Df families for broadband/millimeter‑wave designs.
Taconic TLY‑5 / CER‑10 Very low Df; 77 GHz‑proven insertion loss; Dk tunable by resin content.

âś… Quality & Standards

Built and inspected to IPC‑6018 for HF/microwave PCBs; laminate selection per IPC‑4103 slash sheets. Verification includes TDR, controlled‑impedance test coupons, and microsections.

📡 Applications

Mainly targeted for frequencies from 500 MHz up to mmWave, including:
Automotive 77GHz RadarSatellite Communications (SATCOM)Phased Array AntennasRF Front‑ends / Power AmplifiersAerospace & Defense

Contact Us

Superb Automation Co., Limited

Website:www.superb-tech.com

For 25 years your reliable partner in Electronics & PCBA!

HK number: 85260404363

Email :Info@superb-tech.com

Whatsapp:8613396081443