JP503AS is a low-profile, high-performance 3dB hybrid coupler that is easy to use and features a user-friendly surface-mount package. It is designed for W-CDMA and other 3G applications. JP503AS is specifically tailored for balancing amplifiers, variable phase shifters and attenuators, low-noise amplifiers, and signal distribution. It is an ideal solution for meeting the demands of the wireless industry for smaller printed circuit boards and high performance. The parts have undergone rigorous qualification tests and are manufactured using materials with a coefficient of thermal expansion (CTE), which are compatible with common substrates such as FR4, G-10, RF-35, RO4003, and polyimide. Six soldered finish parts compliant with RoHS standards are produced. 

 

 

JP503AS Characteristics: 

2.0 - 2.3 gigahertz. 

3G frequency 

Low loss 

High isolation degree 

90° Orthogonal 

 Surface Mounting 

Tapes and reels 

Lead-free

 

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