X3C09F1-03S is a low-profile, high-performance 3dB hybrid power amplifier coupler, featuring a new type of surface-mount package that is easy to use and manufacture. It is designed for applications in AMPS, GSM, WCDMA and LTE frequency bands. X3C09F1-03S is specifically tailored for balancing power and low-noise amplifiers, along with signal distribution and other applications that require low insertion loss and strict amplitude and phase balance. It can be used in high-power applications up to 25 watts.
The parts have undergone rigorous testing and have been manufactured using materials with a coefficient of thermal expansion (CTE). These materials are compatible with common substrates such as FR4, G-10, RF-35, RO4003 and polyimide. Six soldered finishings in accordance with RoHS standards have been produced.