X3C21P1-05S is a low-profile, high-performance 5dB directional coupler with a new, user-friendly, surface-mount package that is easy to manufacture. It is designed for WCDMA and LTE applications. X3C21P1-05S is specifically designed for non-binary separation and combination in high-power amplifiers, such as when used in conjunction with 3dB to achieve 3 paths, and other signal distribution applications that require low insertion loss. It can be used in high-power applications up to 60 watts.
The parts have undergone rigorous testing and have been manufactured using materials with a coefficient of thermal expansion (CTE). These materials are compatible with common substrates such as FR4, G-10, RF-35, RO4003 and polyimide. They are produced with a 6/6 tin plating finish in accordance with RoHS standards.