1. RO4003C Core Thickness Options

The core thickness options of RO4003C are labeled in imperial (mil) and metric (mm) units, mainly including:

 8 mil (0.203 mm): Ultra-thin specification, suitable for thickness-sensitive scenarios in high-frequency circuits, such as inner layers of multi-layer boards or microstrip line designs requiring low dielectric constant.

 12 mil (0.305 mm): Medium thickness, balancing signal integrity and mechanical strength. It is often used in hybrid-material multi-layer boards or RF modules requiring medium impedance control.

 20 mil (0.508 mm): One of the most commonly used specifications, applicable to various high-frequency applications such as base station antennas, RF amplifiers and filters, with good processing compatibility.

 32 mil (0.813 mm): Thick option, suitable for designs requiring higher power handling capacity or more complex lamination structures, such as radar systems or industrial microwave equipment.

 60 mil (1.524 mm): Thick substrate option, often used in scenarios requiring high heat dissipation performance or supporting complex components, such as base station RF front-ends or high-power amplifiers.

2. Design & Processing Notes

 Material Compatibility: RO4003C uses hydrocarbon/ceramic filled material, which is compatible with FR-4 standard processing technologies (such as drilling, lamination) without special treatment.

 Copper Foil Options: It is usually paired with 1 oz (35 μm) or 1.5 oz (53 μm) copper foil, which can be selected according to current carrying capacity and impedance requirements.

 Temperature Stability: The glass transition temperature (Tg) of the material is > 280°C, suitable for long-term use in high-temperature environments.

3. Differences Between RO4003 and RO4003C

 Model Distinction: RO4003 is an earlier model, and RO4003C is its upgraded version. The two have basically the same electrical properties such as dielectric constant (DK) and dissipation factor (DF), but RO4003C is superior in processing compatibility and environmental protection (non-halogenated).

 Thickness Overlap: The thickness information of RO4003 is not clearly listed separately in existing data. In practical applications, the thickness specifications of RO4003C can be used as the main reference. If the specific thickness of RO4003 is required, it is recommended to refer to ROGERS official technical documents or contact suppliers for confirmation.

4. Typical Application Scenarios

The thickness selection of RO4003C is usually related to the following application requirements:

 High-Frequency Communication: Such as 5G base station antennas (60 mil thick substrate supports high-power transmission).

 Automotive Electronics: Radar sensors (20 mil or 32 mil thickness balances signal integrity and size).

 Industrial Control: Microwave filters (8 mil or 12 mil thickness for compact designs).

Summary

The standard thickness of RO4003C is mainly 8 mil, 12 mil, 20 mil, 32 mil and 60 mil, covering the needs from ultra-thin to thick substrates. For the RO4003 model, it is recommended to refer to the specifications of RO4003C or contact ROGERS directly for the latest data. The selection should be comprehensively considered based on frequency range, impedance requirements, heat dissipation needs and processing technology.